Dowsil SE-4485L 2.8 Coefficient Thermal Conductivity

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Shenzhen Huazhisheng New Material Technology Co., Ltd.

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Dowsil SE-4485L 2.8 Coefficient Thermal Conductivity

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Dowsil SE-4485L 2.8 Coefficient Thermal Conductivity

Product Overview DOWSIL™ SE 4485 is a single-component, white, moisture-cure thermal adhesive designed for efficient heat dissipation in electronic modules. Its key attributes include: ...

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Dowsil Sealant

Dowsil Silicone Sealant

Dow Silicone Adhesive

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